Voltage supply system with boost converter and charge pump

ABSTRACT

Voltage supply system with boost converter and charge pump. A voltage supply system can include a boost converter controllable to receive an input voltage at an input node and generate an output voltage when the output voltage is greater than or equal to the input voltage. The voltage supply system can include a charge pump controllable to receive the input voltage at the input node and generate the output voltage when the output voltage is less than the input voltage. The voltage supply system can further include a controller configured to receive a control signal and control the boost converter or the charge pump to generate the output voltage at an output node based on the control signal.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.15/622,007, filed Jun. 13, 2017, entitled “VOLTAGE SUPPLY SYSTEM WITHBOOST CONVERTER AND CHARGE PUMP,” which is a divisional of U.S. patentapplication Ser. No. 14/867,186, filed Sep. 28, 2015, entitled “VOLTAGESUPPLY SYSTEM WITH BOOST CONVERTER AND CHARGE PUMP,” which claimspriority to U.S. Provisional Application No. 62/116,458, filed Feb. 15,2015, entitled “DEVICES AND METHODS RELATED TO MULTI-MODE POWERMANAGEMENT,” the disclosure of each of which is hereby expresslyincorporated by reference herein in its entirety.

BACKGROUND Field

The present disclosure generally relates to voltage supply systems.

Description of the Related Art

A power amplification system can be powered by a voltage supply systemthat provides a supply voltage (derived from a battery voltage). Thesupply voltage can be varied to reduce the amount of power used by thepower amplifier. Ideally, a power amplifier supply voltage should followthe average output power over, for example, a 20 dB window from roughly10 volts (V) down to 1 V. Given a nominal battery voltage (Vbatt) ofapproximately 3.8 V, a boost function can be utilized to generate asupply voltage greater than Vbatt, and a buck function can be utilizedto generate a supply voltage less than Vbatt.

SUMMARY

In accordance with some implementations, the present disclosure relatesto a voltage supply system. The voltage supply system includes a boostconverter controllable to receive an input voltage at an input node andgenerate an output voltage when the output voltage is greater than orequal to the input voltage. The voltage supply system includes a chargepump controllable to receive the input voltage at the input node andgenerate the output voltage when the output voltage is less than theinput voltage. The voltage supply system includes a controllerconfigured to receive a control signal and control the boost converteror the charge pump to generate the output voltage at an output nodebased on the control signal.

In some embodiments, in response to the control signal indicating afirst mode, the controller can be configured to control the charge pumpto generate the output voltage less than the input voltage. In someembodiments, in response to the control signal indicating the firstmode, the controller can be configured to control the charge pump togenerate the output voltage of approximately half the input voltage. Insome embodiments, in response to the control signal indicating the firstmode, the controller can be configured to control a charge pump bypasscircuit to pass the output voltage to the output node.

In some embodiments, in response to the control signal indicating asecond mode, the controller can be configured to control the boostconverter to generate the output voltage equal to the input voltage. Insome embodiments, in response to the control signal indicating thesecond mode, the controller can be configured to operate one or moreswitches of the boost converter to pass the input voltage as the outputvoltage to the output node.

In some embodiments, in response to the control signal indicating athird mode, the controller can be configured to control the boostconverter to generate the output voltage greater than the input voltage.In some embodiments, in response to the control signal indicating thethird mode, the controller can be configured to periodically operate oneor more switches of the boost converter to boost the input voltage togenerate the output voltage at the output node.

In some embodiments, the boost converter can include an inductor and oneor more switches. In some embodiments, the one or more switches caninclude a first switch coupled between the inductor and a ground voltageand a second switch coupled between the inductor and the output node. Insome embodiments, the boost converter does not include a switch coupledbetween the inductor and the input node.

In some embodiments, in response to the control signal indicating asecond mode, the controller can be configured to open the first switchand close the second switch to pass the input voltage as the outputvoltage to the output node. In some embodiments, in response to thecontrol signal indicating a third mode, the controller can be configuredto periodically open and close the first switch and second switch toboost the input voltage to generate the output voltage at the outputnode.

In some embodiments, the charge pump can include one or more capacitors.In some embodiments, the charge pump does not include an inductor.

In some embodiments, the input voltage can be substantially equal to abattery voltage.

In some implementations, the present disclosure relates to aradio-frequency (RF) module including a packaging substrate configuredto receive a plurality of components. The RF module includes a voltagesupply system implemented on the packaging substrate. The voltage supplysystem includes a boost converter controllable to receive an inputvoltage at an input node and generate an output voltage when the outputvoltage is greater than or equal to the input voltage. The voltagesupply system includes a charge pump controllable to receive the inputvoltage at the input node and generate the output voltage when theoutput voltage is less than the input voltage. The voltage supply systemincludes a controller configured to control the boost converter or thecharge pump to generate the output voltage at an output node based on areceived control signal.

In some embodiments, the RF module can be a front-end module (FEM).

In some embodiments, the voltage supply system can include a supplydevice and one or more passive devices external to and electricallyconnected to the supply device.

In some implementations, the present disclosure relates to a wirelessdevice including a transceiver configured to generate a radio-frequency(RF) signal. The wireless device includes a front-end module (FEM) incommunication with the transceiver. The FEM includes a packagingsubstrate configured to receive a plurality of components. The FEMincludes a power amplification system implemented on the packagingsubstrate and configured to amplify the RF signal. The poweramplification system includes a voltage supply system. The voltagesupply system includes a boost converter controllable to receive aninput voltage at an input node and generate an output voltage when theoutput voltage is greater than or equal to the input voltage. Thevoltage supply system includes a charge pump controllable to receive theinput voltage at the input node and generate the output voltage when theoutput voltage is less than the input voltage. The voltage supply systemincludes a controller configured to control the boost converter or thecharge pump to generate the output voltage at an output node based on areceived control signal. The wireless device includes an antenna incommunication with the FEM. The antenna is configured to transmit theamplified RF signal.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram of a voltage supply system having oneor more features as described herein.

FIG. 2 illustrates a circuit diagram of example buck-boost converter.

FIG. 3 illustrates a circuit diagram of an example optimized boostconverter.

FIG. 4 illustrates a block diagram of a voltage supply system formulti-mode power management.

FIG. 5 illustrates a voltage supply system including a boost converterand a charge pump.

FIG. 6 illustrates a voltage supply system including a plurality ofswitches.

FIG. 7 illustrates a graph of supply voltage versus output power of apower amplifier receiving the supply voltage.

FIG. 8 illustrates graphs of battery current profiles as a function ofPA power and further illustrates a DG09 profile.

FIG. 9 illustrates a flowchart representation of a method of operating avoltage supply system.

FIG. 10 depicts a module having one or more features as describedherein.

FIG. 11 depicts a wireless device having one or more features describedherein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

FIG. 1 illustrates a block diagram of a voltage supply system 100 havingone or more features as described herein. The voltage supply system 100can generate one or more output voltages, e.g. a supply voltage (Vcc),from an input voltage, e.g., from a battery (Vbatt). The voltage supplysystem 100 can receive the input voltage at an input terminal and supplythe output voltage at an output terminal. The voltage supply system 100can further include an enable terminal for receiving an enabling signaland a reference terminal for receiving a reference voltage (Vref) or asignal indicative of a reference voltage that indicates how the inputvoltage is to be converted into the output voltage. In particular,whereas the input voltage may be relatively fixed, output voltage can bebased on the reference voltage.

In some applications, the voltage supply system 100 of FIG. 1 can beutilized to provide power amplifier (PA) supply voltages in portableelectronic devices such as wireless devices. Although various examplesare described in such a context, it will be understood that one or morefeatures of the present disclosure can also be utilized in otherapplications.

Ideally, a PA supply voltage should follow the average output powerover, for example, a 20 dB window from roughly 10 V (volts) down to 1 V.Given a nominal battery voltage (Vbatt) of approximately 3.8 V, a boostfunction (as performed by a boost converter) can be utilized to generatea supply voltage greater than Vbatt, and a buck function (as performedby a buck converter) can be utilized to generate a supply voltage lessthan Vbatt.

In some PA applications, an important performance parameter is a systemcurrent drain at high output power (e.g., at a supply voltage ofapproximately 9.5 V). Accordingly, boost efficiency is an importantdesign consideration. A buck-boost converter architecture typicallydegrades boost efficiency by about 3-5 points, and is considered to beunacceptable in some PA applications.

Described herein are devices and methods related to a multi-mode powermanagement, in which a boost converter can be configured and utilizedfor a high-power range, a bypass circuit can be configured and utilizedfor a mid-power range, and a charge pump (e.g., including an output ofVbatt/2) can be configured and utilized for a low-power range. Asdescribed herein, such a multi-mode power management system can deliveracceptable performance over substantially the entire dynamic range withfew components (e.g., one capacitor as opposed to one inductor in a buckconverter for low-power range) in the system's bill of materials (BOM).

FIG. 2 illustrates a circuit diagram of example buck-boost converter200. As is generally understood, controlled (e.g., by a controller 201)operations of switches 211-214 can result in accumulation and transferof energy associated with an inductor 221 and a capacitor 231. Suchoperations can result in an output voltage (Vcc) at an output node thatis greater or less than an input voltage (Vbatt) received at an inputnode. For example, Vbatt can be in a range of 2.5 V to 4.8 V, and Vcccan be in a range of 1.2 V to 11 V.

In the buck-boost converter 200 of FIG. 2, a first switch 211 is coupledbetween the input node and the inductor 211, and can be used to providethe buck functionality in which the output voltage is less than theinput voltage. However, the first switch 211 can introduce loss which,in turn, degrades the performance of the boost functionality in whichthe output voltage is greater than the input voltage.

FIG. 3 illustrates a circuit diagram of an example optimized boostconverter 300. Controlled (e.g., by a controller 301) operations ofswitches 311-312 can result in accumulation and transfer of energyassociated with an inductor 321 and a capacitor 331. Such operations canresult in an output voltage (Vcc) at an output node that is greater thanthe input voltage (Vbatt) received at the input node. For example, Vbattcan be in a range of 2.5 V to 4.8 V, and Vout can be around 10 V. In theoptimized boost converter 300, feedback from the output to thecontroller 301 can be implemented to regulate the output voltage at adesired value.

Thus, unlike the buck-boost converter 200 of FIG. 2, the optimized boostconverter 300 of FIG. 3 does not include a switch coupled between theinductor 321 and the input node. However, the optimized boost converter300 of FIG. 3 typically does not support output voltages less than theinput voltage.

The optimized boost converter 300 of FIG. 3 can be controller (e.g., bythe controller 301) to provide bypass functionality. Whereas operationsof switches 311-312 can result in accumulation and transfer of energyassociated with the inductor 321 and the capacitor 331 to provide aboost functionality, opening the first switch 311 and closing the secondswitch 312 can provide a bypass functionality in which the outputvoltage (Vcc) is approximately equal to the input voltage (Vbatt).

FIG. 4 illustrates a block diagram of a voltage supply system 400 formulti-mode power management. The voltage supply system receives an inputvoltage (Vbatt) at an input node and supplies an output voltage (Vcc) atan output node. The voltage supply system 400 includes a supply device402 (e.g., a die or a module) having boost circuitry 404 to generate anoutput voltage greater than the input voltage, bypass circuitry 406 topass the input voltage as the output voltage, and charge pump circuitry408 to generate an output voltage less than the input voltage.

The voltage supply system 400 further includes one or more passivedevices 410 (e.g., capacitors and/or inductors) that can facilitate thevarious functionalities associated with the supply device 400. In someembodiments, the passive device(s) can be external to and electricallyconnected to the supply device. As an example, the boost circuitry 404,an inductor of the passive devices 410, and a capacitor of the passivedevices 410 can form a boost converter such as the optimized boostconverter 300 of FIG. 3. As another example, the charge pump circuitry408 and one or more capacitors of the passive devices 410 can form acharge pump.

In some implementations, the boost circuitry 404 and the bypasscircuitry 406 include at least some of the same components. Inparticular, as described further below, the boost circuitry and thebypass circuitry can both include the same two switches that areconfigurable to provide either boost functionality or bypassfunctionality.

In the example of FIG. 4 (and throughout this disclosure), the inputvoltage is indicated as being provided by a battery (Vbatt). However, itwill be understood that one or more features of the present disclosurecan also be implemented in systems where the input is from a sourceother than a battery.

FIG. 5 illustrates a voltage supply system 500 including a boostconverter and a charge pump. The voltage supply system includes a supplydevice 502 (e.g., a die or a module) an input node 591 to receive aninput voltage (Vbatt) and an output node 592 to supply an output voltage(Vcc). The input node is coupled to a ground voltage via a firstcapacitor 531 that shunts variations in the input voltage. The outputnode 592 is coupled to the ground voltage via a second capacitor 532that shunts variations in the output voltage and implements a capacitorof a boost converter.

The supply device 502 includes two switching nodes 593 a-593 b coupled,via an inductor 521, to the input voltage. The inductor 521 implementsan inductor of the boost converter. The supply device 502 includes twocharge pump nodes 594 a-594 b coupled together via a third capacitor 532that implements a capacitor of a charge pump.

The supply device 502 includes boost converter circuitry 504 that iscontrollable to generate an output voltage greater than (boostfunctionality) or equal to (bypass functionality) the input voltage. Theoutput voltage can be provided to, for example, a high-voltage (HV)power amplifier (PA) as a supply voltage. Such an HV PA can include, forexample, an HV average power tracking (APT) PA. The voltage supplysystem 500 can include a boost converter that includes the boostconverter circuitry 504, the inductor 521, and the second capacitor 532.

The supply device 502 further includes charge pump circuitry 508 that iscontrollable to generate an output voltage less than the input voltage.The charge pump circuitry 508 can be configured to generate alow-voltage (LV) output which is shown to be provided to the output node592 through a bypass circuit 510.

In some embodiments, the charge pump circuitry 508 can operate with thethird capacitor 533 (e.g., a flying capacitance) to generate a desiredoutput which can be, for example, twice the input voltage or half theinput voltage. An example charge pump that can be utilized as the chargepump is described in U.S. Provisional Application No. 62/116,457, filedFeb. 15, 2015, entitled INTERLEAVED DUAL OUTPUT CHARGE PUMP, and U.S.application Ser. No. 14/861,058, filed Sep. 22, 2015, entitledINTERLEAVED DUAL OUTPUT CHARGE PUMP, the disclosure of each of which ishereby expressly incorporated by reference herein in its entirety.

FIG. 6 illustrates a voltage supply system 600 including a plurality ofswitches 611-613. The voltage supply system 600 includes a supply device602 (e.g., a die or a module) including an input node 691 to receive aninput voltage (Vbatt) and an output node 692 to supply an output voltage(Vcc). The input node 691 is coupled to a ground voltage via a firstcapacitor 531 that shunts variations in the input voltage. The outputnode 692 is coupled to the ground voltage via a second capacitor 632that shunts variations in the output voltage and implements a capacitorof a boost converter.

The supply device 602 includes two switching nodes 693 a-693 b coupled,via an inductor 621, to the input voltage. The inductor 621 implementsan inductor of the boost converter. The boost converter further includesboost converter circuitry 604 residing on the supply device 602 thatincludes a first switch 611 coupled between the first switching node 693a and the ground voltage and a second switch 612 coupled between thesecond switching node 693 b and the output node 692.

The first switch 611 and second switch 612 and controllable (e.g., bythe controller 601) for the accumulation and transfer of energyassociated with the inductor 621 and a capacitor 632 to generate anoutput voltage at the output node 692 that is greater than the inputvoltage at the input node 691. Thus, the controller 601 can beconfigured to periodically operate the switches 611-612 to boost theinput voltage to generate the output voltage at the output node 692.

The first switch 611 and second switch 612 are also controllable (e.g.,by the controller 601) to provide a bypass functionality by opening thefirst switch 611 and closing the second switch 612 such that the outputvoltage at the output node 692 is approximately equal to the inputvoltage at the input node 691. Thus, the controller 601 can beconfigured to operate the switches 611-612 to pass the input voltage asthe output voltage to the output node.

In some implementations, the supply device 602 includes a bypass circuit(not shown) separate from the boost converter circuitry 604 to pass theinput voltage as the output voltage to the output node. For example, insome implementations, the first switch 611 and second switch 612 can beimplemented so as to change state rapidly (while performing boostfunctionality) at the expense of higher switch loss. Thus, the supplydevice 602 can include a bypass circuit including a slower switch(coupled in series between the input node 691 and the output node 692)that does not change state as rapidly but has lower switch loss than thesecond switch 612.

The supply device 602 includes two charge pump nodes 694 a-694 b coupledtogether via a third capacitor 632 that implements a capacitor of acharge pump. The supply device 602 includes charge pump circuitry 608that is controllable (e.g., by the controller 601) to generate an outputvoltage less than the input voltage. In some embodiments, the chargepump circuitry 608 can operate with the third capacitor 633 (e.g., aflying capacitance) to generate a desired output which can be, forexample, twice the input voltage or half the input voltage. The outputof the charge pump circuitry 608 can be provided to the output node 692through a bypass circuit 610 including a third switch 613 controllableby the controller 601.

The supply device 602 can include one or more control nodes 695 forreceiving one or more control signals. The control node 695 can becoupled to the controller 601 which can receive and process the controlsignals. Thus, the voltage supply system 600 includes a boost convertercontrollable (e.g., by the controller 601) to receive an input voltageat the input node 691 and generate an output voltage when the outputvoltage is greater than (boost functionality) or equal to (bypassfunctionality) to the input voltage. The boost converter can include theboost control circuitry 604 residing on the supply device 602 and one ormore passive devices external to the supply device 602 (e.g., theinductor 621 and the second capacitor 632). The voltage supply system600 includes a charge pump controllable (e.g., by the controller 601) toreceive the input voltage at the input node 691 and generate the outputvoltage when the output voltage is less than the input voltage. Thecharge pump can include the charge pump circuitry 608 residing on thesupply device 602 and one or more passive devices external to the supplydevice 602 (e.g., the third capacitor 633). The voltage supply system600 includes a controller 601 configured to receive a control signal(e.g., via the control node 695) and control the boost converter or thecharge pump to generate the output voltage at the output node 692 basedon the control signal.

In some implementations, the control signal indicates a mode ofoperation. The control signal can indicate a mode of operation in anumber of ways. In some implementations, the control signal directlyindicates one of a plurality of modes. In some implementations, thecontrol signal indicates a target output power that corresponds to oneof a plurality of modes. In some implementations, the control signalindicates a target supply voltage that corresponds to one of a pluralityof modes.

In response to the control signal indicating a first mode (e.g., alow-voltage mode, a buck mode, or a voltage decrease mode), thecontroller 601 is configured to control the charge pump (e.g., thecharge pump circuitry 608 or one or more switches of the charge pumpcircuitry 608) to generate the output voltage less than the inputvoltage. In some implementations, the controller 601 is configured tocontrol the charge pump to generate the output voltage of approximatelyhalf the input voltage. In some implementations, when the control signalindicates the first mode, the controller 601 is configured to controlthe charge pump bypass circuit 610 to pass the output voltage (from thecharge pump output) to the output node 692. For example, the controller601 can be configured to close the third switch 613 in response to thecontrol signal indicating the first mode.

In response to the control signal indicating a second mode (e.g., amedium-voltage mode, a bypass mode, or a voltage equal mode), thecontroller 601 is configured to control the boost converter to generatethe output voltage equal to the input voltage. In some implementations,the controller 601 is configured to operate one or more switches of theboost converter to pass the input voltage as the output voltage to theoutput node 692. For example, the controller 601 can be configured toopen the first switch 611 and close the second switch 612 to pass theinput voltage as the output voltage to the output node 692.

As noted above, in some implementations, the supply device 602 includesa bypass circuit (not shown) separate from the boost converter circuitry604. Thus, in some implementations, in response to the control signalindicating the second mode, the controller 601 is configured to controlthe bypass circuit to pass the input voltage as the output voltage tothe output node 692.

In response to the control signal indicating a third mode (e.g., ahigh-voltage mode, a boost mode, or a voltage increase mode), thecontroller is configured to control the boost converter to generate theoutput voltage greater than the input voltage. In addition to indicatingthe third mode, the control signal can further indicate a target outputvoltage. The controller 601 can control the boost converter to boost theinput voltage to result in the target output voltage. In someimplementations, the controller 601 is configured to periodicallyoperate one or more switches of the boost converter to boost the inputvoltage to generate the output voltage at the output node 692. Forexample, the controller 601 can be configured to periodically open andclose the first switch 611 and second switch 612 to boost the inputvoltage to generate the output voltage at the output node 692.

As noted above, the boost converter can include the inductor 621 and oneor more switches (e.g., the first switch 611 coupled between theinductor 621 and the ground voltage and the second switch 612 coupledbetween the inductor 621 and the output node 692). In someimplementations, (unlike the converter 200 of FIG. 2), the boostconverter does not include a switch coupled between the inductor 621 andthe input node 691. In particular, the voltage supply system 600 doesnot include a switch coupled between the inductor 621 and the input node691.

The charge pump can include one or more capacitors (e.g., the thirdcapacitor 633). The charge pump can further include one or more switches(e.g., switches of the charge pump circuitry 608). However, in someimplementations, the charge pump does not include an inductor.

Table 1 illustrates a state table of the first switch 611 (S1), secondswitch 612 (S2), and third switch 613 (S3) in response to a controlsignal indicating a mode. In particular, in response to the controlsignal indicating a first mode (e.g., a low-voltage mode), the firstswitch 611 and second switch 612 are off (e.g., open) and the thirdswitch 613 is on (e.g., closed). In response to the control signalindicating a second mode (e.g., a medium-voltage mode), the first switch611 and third switch 613 are off and the second switch 612 is on. Inresponse to the control signal indicating a third mode (e.g., ahigh-voltage mode), the third switch 613 is off and the first switch 611and second switch 612 are operated in a switched mode.

TABLE 1 Mode S1 S2 S3 Low-voltage OFF OFF ON (charge pump)Medium-voltage OFF ON OFF (bypass) High-voltage Switched mode Switchedmode OFF (boost converter)

FIG. 7 illustrates a graph of supply voltage versus output power of apower amplifier receiving the supply voltage. The curve indicated as 732is an example ideal supply voltage profile that can be utilized to yielda range of PA output power. The curve indicated as 731 is an example ofthe multiple output voltages that can be obtained from a voltage supplysystem, e.g., the voltage supply system 600 of FIG. 6. For the purposeof description, it will be assumed that the input voltage issubstantially equal to a battery voltage of 3.8 V.

When a low-power PA output is desired (e.g., a target output power belowa first threshold 741) and the control signal indicates a first mode, alow-voltage output (e.g., Vbatt/2≈1.9V) can be generated by the voltagesupply system 600 utilizing the charge pump. When a medium-power PAoutput is desired (e.g., a target output power between the firstthreshold 741 and the second threshold 742) and the control signalindicates a second mode, a medium-voltage output (e.g., Vbatt) can begenerated by the voltage supply system 600 utilizing the boost converteras a bypass circuit (or by utilizing a separate bypass circuit) When ahigh-power PA output is desired (e.g, a target output voltage above thesecond threshold 742) and the control signal indicates a third mode, ahigh-voltage output can be generated by the voltage supply system 600utilizing the boost converter.

FIG. 8 illustrates graphs of battery current profiles 801-803 as afunction of PA power and further illustrates a DG09 profile 811. TheDG09 profile 811 indicates a likelihood of use at a particular PA power.Thus, typical battery usage is a function of the current drawn, weightedby the DG09 profile, and integrated over PA power.

The first battery current profile 801 illustrates a boost/bypasscombination (e.g., using the converter 300 of FIG. 3), current profile802 illustrates a boost/charge-pump (divide-by-2) combination (e.g.,using the voltage supply system 600 of FIG. 6), and current profile 803illustrates a boost/buck combination (e.g., using the converter 200 ofFIG. 2). At a notable rated power condition of 28 dBm condition, one cansee that the boost/charge-pump (divide-by-2) combination as describedherein results in current savings of about 20 mA, while degrading DG09by only about 1.7 mA.

The current profile 802 illustrates that the boost/charge-pumpcombination outperforms the boost/buck combination at high PA power (dueto the lack of switching loss from the switch coupled between the inputnode and the inductor). The current profile 802 illustrates that theboost/charge-pump combination outperforms the boost/bypass combinationat lower PA power (due to use of a charge pump to lower the inputvoltage).

FIG. 9 illustrates a flowchart representation of a method of operating avoltage supply system. In some implementations (and as detailed below asan example), the method 900 is at least partially performed by acontroller, such as the controller 601 of FIG. 6. In someimplementations, the method 900 is at least partially performed byprocessing logic, including hardware, firmware, software, or acombination thereof. In some implementations, the method 900 is at leastpartially performed by a processor executing code stored in anon-transitory computer-readable medium (e.g., a memory).

The method 900 begins, at block 910, with the controller receiving acontrol signal indicative of one or more modes of a voltage supplysystem. Depending on the result of decision blocks 922 (first mode?),924 (second mode?) or 926 (third mode?), the voltage supply system canbe configured appropriately. If the control signal indicates the firstmode, the controller, in block 932, can control a charge pump togenerate an output voltage less than an input voltage. The controllercan further control a charge pump bypass circuit to couple the outputvoltage to an output mode. If the control signal indicates the secondmode, the controller, in block 934, can control a bypass circuit to passthe input voltage as the output voltage to the output node. If thecontrol signal indicates the third mode, the controller, in block 936,can control a boost converter to generate an output voltage greater thanthe input voltage. In some implementations, the bypass circuit is partof the boost controller. In some implementations, the control signalindicates a target output voltage and the control controls the boostconverter to generate the target output voltage.

At block 940, the controller 940 can control the voltage supply systemto supply the output voltage to a power amplifier.

FIG. 10 shows that in some embodiments, some or all of the voltagesupply system having one or more features as described herein (e.g., theconfigurations of FIGS. 2-6) can be implemented in a module. Such amodule can be, for example, a front-end module (FEM). In the example ofFIG. 10, a module 1000 can include a packaging substrate 1002, and anumber of components can be mounted on such a packaging substrate. Forexample, an FE-PMIC (front-end power management integrated circuit)component 1004, a power amplifier assembly 1006, a match component 1008,and a duplexer assembly 1010 can be mounted and/or implemented on and/orwithin the packaging substrate 1002. Other components such as a numberof SMT devices 1014 (such as the passive devices 410 of FIG. 4 and/orthe inductors and/or capacitors of FIGS. 5 and 6) and an antenna switchmodule (ASM) 1012 can also be mounted on the packaging substrate 1002.Although all of the various components are depicted as being laid out onthe packaging substrate 1002, it will be understood that somecomponent(s) can be implemented over other component(s). In someembodiments, a voltage supply system 1007 having one or more features asdescribed herein can be implemented as a part of the FE-PMIC component1004.

In some implementations, a device and/or a circuit having one or morefeatures described herein can be included in an RF device such as awireless device. Such a device and/or a circuit can be implementeddirectly in the wireless device, in a modular form as described herein,or in some combination thereof. In some embodiments, such a wirelessdevice can include, for example, a cellular phone, a smart-phone, ahand-held wireless device with or without phone functionality, awireless tablet, etc.

FIG. 11 depicts an example wireless device 1100 having one or moreadvantageous features described herein. In the context of a modulehaving one or more features as described herein, such a module can begenerally depicted by a dashed box 1000, and can be implemented as, forexample, a front-end module (FEM).

Referring to FIG. 11, power amplifiers (PAs) 1120 can receive theirrespective RF signals from a transceiver 1110 that can be configured andoperated in known manners to generate RF signals to be amplified andtransmitted, and to process received signals. The transceiver 1110 isshown to interact with a baseband sub-system 1108 that is configured toprovide conversion between data and/or voice signals suitable for a userand RF signals suitable for the transceiver 1110. The transceiver 1110can also be in communication with a power management component 1106 thatis configured to manage power for the operation of the wireless device400. Such power management can also control operations of the basebandsub-system 1108 and the module 1000.

The baseband sub-system 1108 is shown to be connected to a userinterface 1102 to facilitate various input and output of voice and/ordata provided to and received from the user. The baseband sub-system1108 can also be connected to a memory 1104 that is configured to storedata and/or instructions to facilitate the operation of the wirelessdevice, and/or to provide storage of information for the user.

In the example wireless device 1100, outputs of the PAs 1120 are shownto be matched (via respective match circuits 1112) and routed to theirrespective duplexers 1122. Such amplified and filtered signals can berouted to an antenna 1116 through an antenna switch 1114 fortransmission. In some embodiments, the duplexers 1122 can allow transmitand receive operations to be performed simultaneously using a commonantenna (e.g., 1116). In FIG. 11, received signals are shown to berouted to “Rx” paths (not shown) that can include, for example, alow-noise amplifier (LNA).

In some embodiments, a voltage supply system 1007 as described hereincan be implemented as a part of the module 1000.

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Description using the singularor plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A voltage supply system comprising: a boostconverter controllable to receive an input voltage at an input node andgenerate an output voltage when the output voltage is greater than theinput voltage; a bypass circuit controllable to receive the inputvoltage at the input node and pass the input voltage as the outputvoltage to an output node when the output voltage is equal to the inputvoltage; and a charge pump controllable to receive the input voltage atthe input node and generate the output voltage when the output voltageis less than the input voltage.
 2. The voltage supply system of claim 1further comprising a controller configured to receive a control signaland control the boost converter or the charge pump to generate theoutput voltage at the output node based on the control signal.
 3. Thevoltage supply system of claim 2 wherein, in response to the controlsignal indicating a first mode, the controller is configured to controlthe charge pump to generate the output voltage less than the inputvoltage.
 4. The voltage supply system of claim 3 wherein, in response tothe control signal indicating the first mode, the controller isconfigured to control the charge pump to generate the output voltage ofapproximately half the input voltage.
 5. The voltage supply system ofclaim 3 wherein, in response to the control signal indicating the firstmode, the controller is configured to control a charge pump bypasscircuit to pass the output voltage to the output node.
 6. The voltagesupply system of claim 2 wherein, in response to the control signalindicating a second mode, the controller is configured to control theboost converter to generate the output voltage equal to the inputvoltage.
 7. The voltage supply system of claim 6 wherein, in response tothe control signal indicating the second mode, the controller isconfigured to control the bypass circuit to pass the input voltage asthe output voltage to the output node.
 8. The voltage supply system ofclaim 2 wherein, in response to the control signal indicating a thirdmode, the controller is configured to control the boost converter togenerate the output voltage greater than the input voltage.
 9. Thevoltage supply system of claim 8 wherein, in response to the controlsignal indicating the third mode, the controller is configured toperiodically operate one or more switches of the boost converter toboost the input voltage to generate the output voltage at the outputnode.
 10. The voltage supply system of claim 1 wherein the boostconverter includes an inductor and one or more switches.
 11. The voltagesupply system of claim 10 wherein the one or more switches include afirst switch coupled between the inductor and a ground voltage and asecond switch coupled between the inductor and the output node.
 12. Thevoltage supply system of claim 11 wherein, in response to the controlsignal indicating a third mode, the controller is configured toperiodically open and close the first switch and second switch to boostthe input voltage to generate the output voltage at the output node. 13.The voltage supply system of claim 1 wherein the charge pump includesone or more capacitors.
 14. The voltage supply system of claim 13wherein the charge pump does not include an inductor.
 15. The voltagesupply system of claim 1 wherein the input voltage is substantiallyequal to a battery voltage.
 16. A radio-frequency module comprising: apackaging substrate configured to receive a plurality of components; anda voltage supply system implemented on the packaging substrate, thevoltage supply system including a boost converter controllable toreceive an input voltage at an input node and generate an output voltagewhen the output voltage is greater than the input voltage, a bypasscircuit controllable to receive the input voltage at the input node andpass the input voltage as the output voltage to an output node when theoutput voltage is equal to the input voltage, and a charge pumpcontrollable to receive the input voltage at the input node and generatethe output voltage when the output voltage is less than the inputvoltage.
 17. The radio-frequency module of claim 16 wherein theradio-frequency module is a front-end module.
 18. The radio-frequencymodule of claim 16 wherein the voltage supply system includes a supplydevice and one or more passive devices external to and electricallyconnected to the supply device.
 19. The radio-frequency module of claim16 wherein the voltage supply system further includes a controllerconfigured to receive a control signal and control the boost converteror the charge pump to generate the output voltage at the output nodebased on the control signal.
 20. A wireless device comprising: atransceiver configured to generate a radio-frequency signal; a front-endmodule in communication with the transceiver, the front-end moduleincluding a packaging substrate configured to receive a plurality ofcomponents and a power amplification system implemented on the packagingsubstrate and configured to amplify the radio-frequency signal, thepower amplification system including a voltage supply system, thevoltage supply system including a boost converter controllable toreceive an input voltage at an input node and generate an output voltagewhen the output voltage is greater than the input voltage, a bypasscircuit controllable to receive the input voltage at the input node andpass the input voltage as the output voltage to an output node when theoutput voltage is equal to the input voltage, and a charge pumpcontrollable to receive the input voltage at the input node and generatethe output voltage when the output voltage is less than the inputvoltage; and an antenna in communication with the front-end module, theantenna configured to transmit the amplified radio-frequency signal.